AMD has confirmed Zen 6, codenamed “Morpheus,” as its next CPU microarchitecture, succeeding Zen 5. The architecture was shown on AMD’s roadmap in July 2024 and is expected to use TSMC’s 2 nm process for CCDs and 6 nm for the IOD. AMD has set datacenter launches for July 23, 2026, with desktop parts expected in H1 2027.

Core Counts and Platform Segmentation

Zen 6 scales significantly across product tiers. Each Core Complex Die (CCD) will contain up to 12 cores, enabling a maximum of 24 cores (48 threads) on consumer desktop platforms and up to 256 cores (512 threads) on server platforms. Mobile chips will support up to 26 cores, while HEDT/Workstation parts will range from 36 to 144 cores.

Desktop processors will use Socket AM5 and are codenamed “Olympic Ridge,” expected to launch under the Ryzen 10000 brand. Server processors, codenamed “Venice,” “Venice-X,” “Venice LP,” and “Verano,” will use the SP7 and SP8 sockets. HEDT/Workstation Threadripper parts, codenamed “Mustang Peak,” will use Socket sTR6. Mobile codenames include “Bumblebee,” “Medusa Point,” “Medusa Halo,” and “Gator Range.”

Architecture and Instruction Set

Zen 6 carries the CPUID family designation 1Ah and supports DDR5DDR5. A generation of system RAM (memory); newer and faster than DDR4. memory. L1 cache is 80 KB per core (32 KB instructions, 48 KB data), L2 cache is 1 MB per core, and L3 cache is 48 MB per CCD.

The architecture introduces new instruction extensions: AVX512_BMM, AVX_NE_CONVERT, AVX_IFMA, AVX_VNNI_INT8, and AVX512_FP16. Zen 6 is also expected to be the first AMD platform supporting Flexible Return and Event Delivery (FRED), replacing the legacy IDT mechanism.

Variants and Console Integration

Three variants are planned. Standard Zen 6 (“Morpheus”) targets desktop and mainstream segments. Zen 6c (“Monarch”) is a high-core-density variant for server and likely mobile platforms. Zen 6 LP is a new low-power variant—a condensed, underclocked form of Zen 6c retaining the same IPC and instruction sets, designed for background tasks and hybrid sleep. Zen 6 LP is expected to appear in mobile chips, handheld APUs, the upcoming PlayStation 6 console and handheld SoCs, and the next Xbox console’s SoC.